Report confirms Apple's decision to use SiPs for next iPhone models

Phone ArenaReport confirms Apple's decision to use SiPs for next iPhone modelsPhone ArenaBack in March, we passed along a rumor out of China that said Apple would be using System in Package (SiP) technology along with a Printed Circuit Board (PCB) on the next iteration of the Apple iPhone. This morning, a fresh new report from China ...iPhone 6s Rumored To Take Advantage Of SiP Modular ArchitectureWCCFtechiPhone 6s To Make "Extensive" Use Of SiP Modular Architecture (Rumor)G 4 Games (press release) (blog)all 3 news articles »